Curing of low level melamine-modified urea-formaldehyde particleboard binder resins studied with dynamic mechanical analysis (DMA)
2005 ◽
Vol 97
(1)
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pp. 377-389
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Keyword(s):
1995 ◽
Vol 58
(10)
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pp. 1689-1700
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2008 ◽
Vol 108
(3)
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pp. 2045-2051
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