Sequential interpenetrating polymer network of poly(ethyl methacrylate) and carboxylated nitrile rubber: Dynamic mechanical analysis and morphology

2005 ◽  
Vol 96 (5) ◽  
pp. 1487-1491 ◽  
Author(s):  
N.R. Manoj ◽  
R.D. Raut ◽  
P. Sivaraman ◽  
D. Ratna ◽  
B.C. Chakraborty
Keyword(s):  
Dynamic Mechanical Analysis ◽  
Polymer Network ◽  
Mechanical Analysis ◽  
Nitrile Rubber ◽  
Interpenetrating Polymer Network ◽  
Dynamic Mechanical ◽  
Ethyl Methacrylate

Dynamic Mechanical Analysis (DMA) of CMP pad materials

2000 ◽  
Vol 613 ◽  
Author(s):  
Irene Li ◽  
Kersten M. Forsthoefel ◽  
Kathleen A. Richardson ◽  
Yaw S. Obeng ◽  
William G. Easter ◽  
...  
Keyword(s):  
High Temperature ◽  
Dynamic Mechanical Analysis ◽  
Semiconductor Industry ◽  
Polymer Network ◽  
Chemical Exposure ◽  
Mechanical Analysis ◽  
Process Conditions ◽  
Temperature Transition ◽  
Basic Oxide ◽  
Dynamic Mechanical

ABSTRACTIn the semiconductor industry, there is a need to establish fundamental, mechanism-based, correlation(s) between process conditions, consumables (e.g., pads and slurries), and observed process performance in Chemical-Mechanical Polishing (CMP). In this paper, we present recent results of studies on polyurethane-based CMP pads in static and dynamic conditions using Dynamic Mechanical Analysis (DMA) to monitor modulus and energy damping changes. Two-layered, composite IC1000 on Suba IV pads, [IC1000 (cast and cured polyurethane elastomer) / Suba IV (polyurethane impregnated polyester felt)], were analyzed: prior to use (fresh); after a 24-hr soak in silica-containing oxide slurry (basic); and after oxide polishing (used). Upon comparison it was observed that a characteristic transition feature due to water is present at sub-ambient temperatures in both the slurry soaked and used pads. Exposure of as-received pads to basic oxide slurry results in a broad, high temperature transition thought to be the result of chemical-induced disruption of macrostructural units. Polishing (load-enhanced chemical exposure) introduces further changes to the polymer network represented by an apparent degradation to the structural species responsible for the high temperature transition in Suba IV.

A Study on the Blends of Epoxy/Polybutadiene and the Application to the Encapsulation of a Capacitor

1992 ◽  
Vol 274 ◽  
Author(s):  
Zhongyuan Ren ◽  
Liying Qui
Keyword(s):  
Phase Separation ◽  
Dynamic Mechanical Analysis ◽  
Low Temperatures ◽  
Epoxy Resins ◽  
Mechanical Analysis ◽  
Dynamic Mechanical

ABSTRACTThis paper describes the blends of epoxy/polybutadiene and the application of the blends to the encapsulation of capacitors. Experiments showed that the hydroxy-carboxyl terminated polybutadiene (HCTPB) had a good toughening effect on epoxy resins, and the blends of epoxy/HTPB or epoxy/HCTPB had good craze resistance at low temperatures. The phase separation and dynamic mechanical analysis of these blends are discussed below.

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