A new approach to batch process optimization using experimental design

AIChE Journal ◽  
2009 ◽  
Vol 55 (2) ◽  
pp. 342-353 ◽  
Author(s):  
Paul J. Wissmann ◽  
Martha A. Grover
Keyword(s):  
Experimental Design ◽  
Process Optimization ◽  
Batch Process ◽  
New Approach

scholarly journals Constrained Q-Learning for Batch Process Optimization

2021 ◽  
Vol 54 (3) ◽  
pp. 492-497
Author(s):  
Elton Pan ◽  
Panagiotis Petsagkourakis ◽  
Max Mowbray ◽  
Dongda Zhang ◽  
Antonio del Rio-Chanona
Keyword(s):  
Process Optimization ◽  
Batch Process ◽  
Q Learning

High Value Thin Wafer Support Technology for 3DIC

2014 ◽  
Vol 2014 (1) ◽  
pp. 000718-000723
Author(s):  
Jared Pettit ◽  
Alman Law ◽  
Alex Brewer ◽  
John Moore
Keyword(s):  
Adhesion Force ◽  
Low Cost ◽  
New Technology ◽  
Value Added ◽  
Batch Process ◽  
New Approach ◽  
Wide Range ◽  
Temporary Bonding ◽  
Technical Challenges ◽  
Conventional Practice

As the 3DIC market matures, more is understood about the technical and cost challenges [1]. At the 2013 Semicon-West gathering, a panel of global experts identified these technical challenges to represent some of the most significant barriers to the industry's efforts to maintain progress with Moore's Law [2]. Searching and achieving high value manufacturing of 3DIC devices requires wrestling with several technologies and processes, all which may assert a different value for the manufacturer [3]. Current technologies for thin wafer support use a wide range of adhesives applied to the device wafer, bonded to a carrier, backside processed, and de-bonded by an array of methods. Daetec has been investigating temporary bonding for nearly 15yrs, is producing a range of products for semiconductor (e.g. WaferBondTM (Brewer-Science, Inc.)) [4], and for the display market using a low-cost tunable adhesion-force material that is peeled by simple means [5]. Daetec has developed a new technology, DaeBond 3DTM, allowing de-bonding to occur in a batch process while thinned wafers are affixed to film frames. This new approach provides a shift in conventional practice. Our paper presents several temporary bonding options with DaeBond 3DTM in an effort to define value-added approaches for thin wafer handling.

Semi-batch process optimization under uncertainty: Theory and experiments

1998 ◽  
Vol 22 (1-2) ◽  
pp. 201-213 ◽  
Author(s):  
Peter Terwiesch ◽  
Dag Ravemark ◽  
Benedikt Schenker ◽  
David W.T. Rippin
Keyword(s):  
Process Optimization ◽  
Uncertainty Theory ◽  
Batch Process ◽  
Optimization Under Uncertainty ◽  
Theory And Experiments

Process Optimization of Cefradine/ Montmorillionite in Solution Intercalation

2011 ◽  
Vol 306-307 ◽  
pp. 831-834
Author(s):  
Yan Zhao Zhao ◽  
Wen Ji Guo ◽  
Lan Wang
Keyword(s):  
Experimental Design ◽  
Process Optimization ◽  
Reaction Temperature ◽  
Drug Concentration ◽  
Orthogonal Design ◽  
Experimental Results ◽  
Mass Ratio ◽  
Drug Load ◽  
Solution Intercalation ◽  
Initial Concentration

One-factor-at-a-time design and orthogonal design were used in the experimental design to optimize the process of preparation for Cefradine /Montmorillionite composites in solution intercalation. Experimental results indicate that drug initial concentration was the most significant condition for optimal preparation of composites, intercalation time and reaction temperature were not so significant. In our paper, the maximum drug load occurred at reaction temperature of 60°C with the intercalation time of 2h when the drug concentration (mass ratio of cefradine to MMT) was 2:1.

Welding Process Optimization Through Experimental Design: An Experience

2002 ◽  
Vol 14 (1) ◽  
pp. 33-44 ◽  
Author(s):  
Pedro Grima ◽  
Xavier Tort-Martorell ◽  
Bovas Abraham
Keyword(s):  
Experimental Design ◽  
Process Optimization ◽  
Welding Process

Experimental Design and Process Optimization

2014 ◽  
Author(s):  
Maria Isabel Rodrigues ◽  
Antonio Francisco Iemma
Keyword(s):  
Experimental Design ◽  
Process Optimization
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