Assessing the Applicability of Gravity Separation for Recycling of Non‐Metal Fraction from Waste Printed Circuit Boards

2020 ◽  
pp. 2000231
Author(s):  
Amit Kumar ◽  
Maria E. Holuszko ◽  
Travis Janke
2018 ◽  
Vol 78 ◽  
pp. 559-565 ◽  
Author(s):  
Long Meng ◽  
Yiwei Zhong ◽  
Lei Guo ◽  
Zhe Wang ◽  
Kuiyuan Chen ◽  
...  

2020 ◽  
Vol 248 ◽  
pp. 119235 ◽  
Author(s):  
Xiang-nan Zhu ◽  
Chun-chen Nie ◽  
Sha-sha Wang ◽  
Yue Xie ◽  
Hao Zhang ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (16) ◽  
pp. 4566
Author(s):  
Yushuai Xian ◽  
Youjun Tao ◽  
Fangyuan Ma ◽  
You Zhou

The recovery and reuse of waste printed circuit boards (PCBs) has attracted more and more attention from global researchers, as recycling of waste PCB metals is of great significance to the rational utilization of metal material resources. This study puts forward a clean and economical method in which enhanced gravity separation and wet high-gradient magnetic separation were combined to recover waste PCBs with heat treatment at a temperature of 240 °C. The heat treatment could improve the metal liberation effect of the PCBs, and the thermal behavior was measured by thermogravimetric analysis (TGA). The pyrolysis of the non-metal fraction (NMF) began around 300 °C, and the glass transition temperature of epoxy resin was 135.17 °C. The enhanced gravity separation technique was used for the separation of metals and NMF under the compound force field. The metals grade of the gravity concentrates fraction (GRF) was 82.97% under the optimal conditions, and the metals recovery reached 90.55%. A wet high-gradient magnetic separator was applied to classify the GRF into magnetic (MA) and non-magnetic (NMA) fractions, which could achieve iron and copper enrichment. After the three stages combined process, the copper and iron grades of the NMA and MA fractions were 70.17% and 73.42%, and the recovery reached 74.02% and 78.11%, respectively.


2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo

JOM ◽  
2020 ◽  
Author(s):  
Joona Rajahalme ◽  
Siiri Perämäki ◽  
Roshan Budhathoki ◽  
Ari Väisänen

AbstractThis study presents an optimized leaching and electrowinning process for the recovery of copper from waste printed circuit boards including studies of chemical consumption and recirculation of leachate. Optimization of leaching was performed using response surface methodology in diluted sulfuric acid and hydrogen peroxide media. Optimum leaching conditions for copper were found by using 3.6 mol L−1 sulfuric acid, 6 vol.% hydrogen peroxide, pulp density of 75 g L−1 with 186 min leaching time at 20°C resulting in complete leaching of copper followed by over 92% recovery and purity of 99.9% in the electrowinning. Study of chemical consumption showed total decomposition of hydrogen peroxide during leaching, while changes in sulfuric acid concentration were minor. During recirculation of the leachate with up to 5 cycles, copper recovery and product purity remained at high levels while acid consumption was reduced by 60%.


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