Repetitive Hole-Mask Colloidal Lithography for the Fabrication of Large-Area Low-Cost Plasmonic Multishape Single-Layer Metasurfaces

2015 ◽  
Vol 3 (5) ◽  
pp. 680-686 ◽  
Author(s):  
Jun Zhao ◽  
Sarah Jaber ◽  
Paul Mulvaney ◽  
Paul V. Braun ◽  
Harald Giessen
Keyword(s):  
Low Cost ◽  
Single Layer ◽  
Colloidal Lithography ◽  
Large Area

Computer simulation study about the dependence of amorphous silicon photonic waveguides efficiency on the material quality

2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira
Keyword(s):  
Amorphous Silicon ◽  
High Throughput Screening ◽  
Simulation Analysis ◽  
Low Cost ◽  
Deposition Process ◽  
Large Area ◽  
Sidewall Roughness ◽  
Sensing Applications ◽  
Fabrication Defects ◽  
The Impact

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.

Bamboo Waste-based Bio-composite Substance: An application for Low-cost Construction Materials

2020 ◽  
Vol 4 (1) ◽  
pp. 41-48
Author(s):  
Teodoro Astorga Amatosa ◽  
Michael E. Loretero
Keyword(s):  
Composite Materials ◽  
Sea Water ◽  
Raw Materials ◽  
Low Cost ◽  
Construction Materials ◽  
Single Layer ◽  
High Strength ◽  
Green Technology ◽  
Experimental Medium ◽  
Natural Treatment

Bamboo is a lightweight and high-strength raw materials that encouraged researchers to investigate and explore, especially in the field of biocomposite and declared as one of the green-technology on the environment as fully accountable as eco-products. This research was to assess the technical feasibility of making single-layer experimental Medium-Density Particleboard panels from the bamboo waste of a three-year-old (Dendrocalamus asper). Waste materials were performed to produce composite materials using epoxy resin (C21H25C105) from a natural treatment by soaking with an average of pH 7.6 level of sea-water. Three different types of MDP produced, i.e., bamboo waste strip MDP (SMDP), bamboo waste chips MDP (CMDP) and bamboo waste mixed strip-chips MDP (MMDP) by following the same process. The experimental panels tested for their physical-mechanical properties according to the procedures defined by ASTM D1037-12. Conclusively, even the present study shows properties of MDP with higher and comparable to other composite materials; further research must be given better attention as potential substitute to be used as hardwood materials, especially in the production, design, and construction usage.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

A novel low cost texturization method for large area commercial mono-crystalline silicon solar cells

2006 ◽  
Vol 90 (20) ◽  
pp. 3557-3567 ◽  
Author(s):  
U. Gangopadhyay ◽  
K.H. Kim ◽  
S.K. Dhungel ◽  
U. Manna ◽  
P.K. Basu ◽  
...  
Keyword(s):  
Solar Cells ◽  
Crystalline Silicon ◽  
Low Cost ◽  
Silicon Solar Cells ◽  
Large Area ◽  
Crystalline Silicon Solar Cells

scholarly journals Mastering of NIL Stamps with Undercut T-Shaped Features from Single Layer to Multilayer Stamps

Nanomaterials ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 956
Author(s):  
Philipp Taus ◽  
Adrian Prinz ◽  
Heinz D. Wanzenboeck ◽  
Patrick Schuller ◽  
Anton Tsenov ◽  
...  
Keyword(s):  
Electron Beam Lithography ◽  
Nanoimprint Lithography ◽  
Silicon Oxide ◽  
Three Dimensional ◽  
Single Layer ◽  
Fabrication Technology ◽  
Large Area ◽  
Structural Colors ◽  
Biomimetic Structures ◽  
Morpho Butterfly

Biomimetic structures such as structural colors demand a fabrication technology of complex three-dimensional nanostructures on large areas. Nanoimprint lithography (NIL) is capable of large area replication of three-dimensional structures, but the master stamp fabrication is often a bottleneck. We have demonstrated different approaches allowing for the generation of sophisticated undercut T-shaped masters for NIL replication. With a layer-stack of phase transition material (PTM) on poly-Si, we have demonstrated the successful fabrication of a single layer undercut T-shaped structure. With a multilayer-stack of silicon oxide on silicon, we have shown the successful fabrication of a multilayer undercut T-shaped structures. For patterning optical lithography, electron beam lithography and nanoimprint lithography have been compared and have yielded structures from 10 µm down to 300 nm. The multilayer undercut T-shaped structures closely resemble the geometry of the surface of a Morpho butterfly, and may be used in future to replicate structural colors on artificial surfaces.

scholarly journals Superhydrophobicity and Durability in Recyclable Polymers Coating

2021 ◽  
Vol 13 (15) ◽  
pp. 8244
Author(s):  
Francesca Cirisano ◽  
Michele Ferrari
Keyword(s):  
Thermal Treatment ◽  
Superhydrophobic Surface ◽  
Low Cost ◽  
Spray Coating ◽  
Large Area ◽  
Average Roughness ◽  
Water Contact ◽  
Alkaline Environments ◽  
Fine Control ◽  
Recycle And Reuse

Highly hydrophobic and superhydrophobic materials obtained from recycled polymers represent an interesting challenge to recycle and reuse advanced performance materials after their first life. In this article, we present a simple and low-cost method to fabricate a superhydrophobic surface by employing polytetrafluoroethylene (PTFE) powder in polystyrene (PS) dispersion. With respect to the literature, the superhydrophobic surface (SHS) was prepared by utilizing a spray- coating technique at room temperature, a glass substrate without any further modification or thermal treatment, and which can be applied onto a large area and on to any type of material with some degree of fine control over the wettability properties. The prepared surface showed superhydrophobic behavior with a water contact angle (CA) of 170°; furthermore, the coating was characterized with different techniques, such as a 3D confocal profilometer, to measure the average roughness of the coating, and scanning electron microscopy (SEM) to characterize the surface morphology. In addition, the durability of SH coating was investigated by a long-water impact test (raining test), thermal treatment at high temperature, an abrasion test, and in acidic and alkaline environments. The present study may suggest an easy and scalable method to produce SHS PS/PTFE films that may find implementation in various fields.

scholarly journals A single layer deposition of Li-doped mesoporous TiO2 beads for low-cost and efficient dye-sensitized solar cells

2021 ◽  
Vol 45 (5) ◽  
pp. 2470-2477
Author(s):  
P. Golvari ◽  
E. Nouri ◽  
N. Mohsenzadegan ◽  
M. R. Mohammadi ◽  
S. O. Martinez-Chapa
Keyword(s):  
Light Scattering ◽  
Low Cost ◽  
Dye Sensitized Solar Cells ◽  
Single Layer ◽  
Cost Effective ◽  
Mesoporous Tio2 ◽  
Trap States ◽  
Dye Sensitized ◽  
Layer Deposition ◽  
Sensitized Solar Cells

Cost-effective DSCs with superior electronic properties are gained by a reduction in electronic trap states and outstanding light scattering and harvesting.

scholarly journals Single-Layer Line-Fed Broadband Microstrip Patch Antenna on Thin Substrates

Electronics ◽  
2020 ◽  
Vol 10 (1) ◽  
pp. 37
Author(s):  
Roberto Vincenti Gatti ◽  
Riccardo Rossi ◽  
Marco Dionigi
Keyword(s):  
Patch Antenna ◽  
State Of The Art ◽  
Low Cost ◽  
Single Layer ◽  
Microstrip Antennas ◽  
Microstrip Patch Antenna ◽  
Layer Line ◽  
Limited Bandwidth ◽  
Microstrip Patch ◽  
Effective Design

In this work, the issue of limited bandwidth typical of microstrip antennas realized on a single thin substrate is addressed. A simple yet effective design approach is proposed based on the combination of traditional single-resonance patch geometries. Two novel shaped microstrip patch antenna elements with an inset feed are presented. Despite being printed on a single-layer substrate with reduced thickness, both radiators are characterized by a broadband behavior. The antennas are prototyped with a low-cost and fast manufacturing process, and measured results validate the simulations. State-of-the-art performance is obtained when compared to the existing literature, with measured fractional bandwidths of 3.71% and 6.12% around 10 GHz on a 0.508-mm-thick Teflon-based substrate. The small feeding line width could be an appealing feature whenever such radiating elements are to be used in array configurations.

scholarly journals 2D MoS2 Encapsulated Silicon Nanopillar Array with High-Performance Light Trapping Obtained by Direct CVD Process

Crystals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 267
Author(s):  
Minyu Bai ◽  
Zhuoman Wang ◽  
Jijie Zhao ◽  
Shuai Wen ◽  
Peiru Zhang ◽  
...  
Keyword(s):  
Silicon Substrate ◽  
High Performance ◽  
Low Cost ◽  
Light Trapping ◽  
Incident Light ◽  
Single Layer ◽  
Chemical Vapor ◽  
Optoelectronic Device ◽  
Planar Silicon ◽  
Shortwave Infrared

Weak absorption remains a vital factor that limits the application of two-dimensional (2D) materials due to the atomic thickness of those materials. In this work, a direct chemical vapor deposition (CVD) process was applied to achieve 2D MoS2 encapsulation onto the silicon nanopillar array substrate (NPAS). Single-layer 2D MoS2 monocrystal sheets were obtained, and the percentage of the encapsulated surface of NPAS was up to 80%. The reflection and transmittance of incident light of our 2D MoS2-encapsulated silicon substrate within visible to shortwave infrared were significantly reduced compared with the counterpart planar silicon substrate, leading to effective light trapping in NPAS. The proposed method provides a method of conformal deposition upon NPAS that combines the advantages of both 2D MoS2 and its substrate. Furthermore, the method is feasible and low-cost, providing a promising process for high-performance optoelectronic device development.

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