Curvature and Stress Effects on the Performance of Contour‐Mode Resonant Δ E Effect Magnetometers

2021 ◽  
pp. 2100294
Author(s):  
Alexei D. Matyushov ◽  
Benjamin Spetzler ◽  
Mohsen Zaeimbashi ◽  
James Zhou ◽  
Zhenyun Qian ◽  
...  
Keyword(s):  
Stress Effects ◽  
Contour Mode

Lexical Stress Effects in Silent Reading

2008 ◽  
Author(s):  
Mara E. Breen ◽  
Charles E. Clifton
Keyword(s):  
Silent Reading ◽  
Lexical Stress ◽  
Stress Effects

Stress effects of amyloodiniosis in gilthead sea bream Sparus aurata

2018 ◽  
Vol 127 (3) ◽  
pp. 201-211 ◽  
Author(s):  
M Moreira ◽  
M Herrera ◽  
P Pousão-Ferreira ◽  
JI Navas Triano ◽  
F Soares
Keyword(s):  
Sparus Aurata ◽  
Gilthead Sea Bream ◽  
Sea Bream ◽  
Stress Effects

Improved Burn-In Stress Methodology for Stress Uniformity

2018 ◽  
Author(s):  
Jungsuk Ko ◽  
Hoonchang yang ◽  
Hyungchae Jeon ◽  
Gyuyoung Nam ◽  
Youngseok Ryu ◽  
...  
Keyword(s):  
Temperature Stress ◽  
Stress Condition ◽  
Temperature Deviation ◽  
Stress Effects ◽  
Hot Temperature ◽  
Production Environments ◽  
Stress Environment ◽  
The Stability ◽  
Stress Uniformity ◽  
Stress Voltage

Abstract The necessity of hot temperature stress is widely recognized as the initial stress methodology to maintain the stability of products from infant defects in device [1, 2]. However, hot temperature stress has a disadvantage in terms of stress uniformity because temperature variation according to stress environment such as chamber, board, and tester accelerates different stress effects per chips. In addition, this stress condition can cause serious reliability problem in the mass production environments. Therefore, the stress temperature should be lowered to minimize the temperature deviation due to the production environments. The reduction of stress temperature cause the lack of stress amount, so optimized stress voltage and time to maintain the stress condition is required. In this study, various stress voltage and time with decreasing temperature were evaluated in consideration of lifetime that unit elements such transistors and capacitors did not degrade by any stress conditions. In addition, it was confirmed that stress uniformity can be improved in the stress condition obtained by the evaluation. Furthermore, the enhanced initial failure screen ability was proven with mass evaluations.

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