scholarly journals Silicon Photonics: Silicon Photonic Platform for Passive Waveguide Devices: Materials, Fabrication, and Applications (Adv. Mater. Technol. 8/2020)

2020 ◽  
Vol 5 (8) ◽  
pp. 2070046
Author(s):  
Yikai Su ◽  
Yong Zhang ◽  
Ciyuan Qiu ◽  
Xuhan Guo ◽  
Lu Sun
Keyword(s):  
Silicon Photonics ◽  
Waveguide Devices ◽  
Silicon Photonic

Ultra-Small Silicon Photonic Wire Waveguide Devices

2009 ◽  
Vol E92-C (2) ◽  
pp. 217-223 ◽  
Author(s):  
Tao CHU ◽  
Hirohito YAMADA ◽  
Shigeru NAKAMURA ◽  
Masashige ISHIZAKA ◽  
Masatoshi TOKUSHIMA ◽  
...  
Keyword(s):  
Waveguide Devices ◽  
Silicon Photonic ◽  
Photonic Wire

scholarly journals Scaling capacity of fiber-optic transmission systems via silicon photonics

Nanophotonics ◽  
2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Wei Shi ◽  
Ye Tian ◽  
Antoine Gervais
Keyword(s):  
Silicon Photonics ◽  
Communication Systems ◽  
Large Scale ◽  
Recent Progress ◽  
Fiber Optic ◽  
Rapid Evolution ◽  
System Capacity ◽  
Disruptive Technology ◽  
System Perspective ◽  
Silicon Photonic

AbstractThe tremendous growth of data traffic has spurred a rapid evolution of optical communications for a higher data transmission capacity. Next-generation fiber-optic communication systems will require dramatically increased complexity that cannot be obtained using discrete components. In this context, silicon photonics is quickly maturing. Capable of manipulating electrons and photons on the same platform, this disruptive technology promises to cram more complexity on a single chip, leading to orders-of-magnitude reduction of integrated photonic systems in size, energy, and cost. This paper provides a system perspective and reviews recent progress in silicon photonics probing all dimensions of light to scale the capacity of fiber-optic networks toward terabits-per-second per optical interface and petabits-per-second per transmission link. Firstly, we overview fundamentals and the evolving trends of silicon photonic fabrication process. Then, we focus on recent progress in silicon coherent optical transceivers. Further scaling the system capacity requires multiplexing techniques in all the dimensions of light: wavelength, polarization, and space, for which we have seen impressive demonstrations of on-chip functionalities such as polarization diversity circuits and wavelength- and space-division multiplexers. Despite these advances, large-scale silicon photonic integrated circuits incorporating a variety of active and passive functionalities still face considerable challenges, many of which will eventually be addressed as the technology continues evolving with the entire ecosystem at a fast pace.

Silicon Photonic Platform for Passive Waveguide Devices: Materials, Fabrication, and Applications

2020 ◽  
Vol 5 (8) ◽  
pp. 1901153 ◽  
Author(s):  
Yikai Su ◽  
Yong Zhang ◽  
Ciyuan Qiu ◽  
Xuhan Guo ◽  
Lu Sun
Keyword(s):  
Waveguide Devices ◽  
Silicon Photonic

Progress in silicon platforms for integrated optics

Nanophotonics ◽  
2014 ◽  
Vol 3 (4-5) ◽  
pp. 205-214 ◽  
Author(s):  
Ari Novack ◽  
Matt Streshinsky ◽  
Ran Ding ◽  
Yang Liu ◽  
Andy Eu-Jin Lim ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
High Speed ◽  
Passive Components ◽  
Development Costs ◽  
Silicon Photonic ◽  
Building Systems ◽  
Recent Developments ◽  
Process Risk ◽  
Further Development ◽  
Made In

AbstractRapid progress has been made in recent years repurposing CMOS fabrication tools to build complex photonic circuits. As the field of silicon photonics becomes more mature, foundry processes will be an essential piece of the ecosystem for eliminating process risk and allowing the community to focus on adding value through clever design. Multi-project wafer runs are a useful tool to promote further development by providing inexpensive, low-risk prototyping opportunities to academic and commercial researchers. Compared to dedicated silicon manufacturing runs, multi-project-wafer runs offer cost reductions of 100× or more. Through OpSIS, we have begun to offer validated device libraries that allow designers to focus on building systems rather than modifying device geometries. The EDA tools that will enable rapid design of such complex systems are under intense development. Progress is also being made in developing practical optical and electronic packaging solutions for the photonic chips, in ways that eliminate or sharply reduce development costs for the user community. This paper will provide a review of the recent developments in silicon photonic foundry offerings with a focus on OpSIS, a multi-project-wafer foundry service offering a silicon photonics platform, including a variety of passive components as well as high-speed modulators and photodetectors, through the Institute of Microelectronics in Singapore.

Silicon photonic-wire waveguide devices

2007 ◽  
Author(s):  
Tao Chu ◽  
Hirohito Yamada ◽  
Shigeru Nakamura ◽  
Makoto Tojo ◽  
Yutaka Urino ◽  
...  
Keyword(s):  
Waveguide Devices ◽  
Silicon Photonic ◽  
Photonic Wire

scholarly journals Low-Cost 400 Gbps DR4 Silicon Photonics Transmitter for Short-Reach Datacenter Application

Nanomaterials ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1941
Author(s):  
Haike Zhu ◽  
Sean Anderson ◽  
Nick Karfelt ◽  
Lingjun Jiang ◽  
Yunchu Li ◽  
...  
Keyword(s):  
Form Factor ◽  
Silicon Photonics ◽  
High Speed ◽  
Low Cost ◽  
Optical Components ◽  
Test Board ◽  
Silicon Photonic ◽  
Transceiver Module ◽  
Photonic Circuit ◽  
And Performance

Targeting high-speed, low-cost, short-reach intra-datacenter connections, we designed and tested an integrated silicon photonic circuit as a transmitter engine. This engine can be packaged into an optical transceiver module which meets the QSFP-DD Form Factor, together with other electrical/optical components. We first present the design and performance of a high-speed silicon modulator, which had a 3-dB EO bandwidth of >40 GHz and an ER of >5 dB. We then incorporated the engine onto a test board and injected a 53.125 Gbaud PAM4 signal. Clear eye patterns were observed at the receiver with TDECQ ~3 dB for all four lanes.

scholarly journals Novel Low-Loss Fiber-Chip Edge Coupler for Coupling Standard Single Mode Fibers to Silicon Photonic Wire Waveguides

Photonics ◽  
2021 ◽  
Vol 8 (3) ◽  
pp. 79
Author(s):  
Siwei Sun ◽  
Ying Chen ◽  
Yu Sun ◽  
Fengman Liu ◽  
Liqiang Cao
Keyword(s):  
Optical Fibers ◽  
Silicon Photonics ◽  
Coupling Efficiency ◽  
Single Mode ◽  
Spot Size ◽  
Silicon On Insulator ◽  
Multiple Structure ◽  
Silicon Photonic ◽  
Mode Size ◽  
Photonic Wire

Fiber-to-chip optical interconnects is a big challenge in silicon photonics application scenarios such as data centers and optical transmission systems. An edge coupler, compared to optical grating, is appealing to in the application of silicon photonics due to the high coupling efficiency between standard optical fibers (SMF-28) and the sub-micron silicon wire waveguides. In this work, we proposed a novel fiber–chip edge coupler approach with a large mode size for silicon photonic wire waveguides. The edge coupler consists of a multiple structure which was fulfilled by multiple silicon nitride layers embedded in SiO2 upper cladding, curved waveguides and two adiabatic spot size converter (SSC) sections. The multiple structure can allow light directly coupling from large mode size fiber-to-chip coupler, and then the curved waveguides and SSCs transmit the evanescent field to a 220 nm-thick silicon wire waveguide based on the silicon-on-insulator (SOI) platform. The edge coupler, designed for a standard SMF-28 fiber with 8.2 μm mode field diameter (MFD) at a wavelength of 1550 nm, exhibits a mode overlap efficiency exceeding 95% at the chip facet and the overall coupling exceeding 90%. The proposed edge coupler is fully compatible with standard microfabrication processes.

scholarly journals Measurements of a Silicon Photonic ROADM (Project Report CIAN2-3-Y3)

2022 ◽  
Author(s):  
Shayan Mookherjee
Keyword(s):  
Silicon Photonics ◽  
Silicon Waveguides ◽  
Project Report ◽  
Variable Optical Attenuator ◽  
Silicon Photonic ◽  
Doped Silicon ◽  
University Partnership

A multi-university partnership led by UCSD collaborated with Sandia National Labs in an NSF-funded silicon photonics multi-project wafer (MPW) project. This is a report of the ROADM +VOA (reconfigurable optical add drop multiplexer + variable optical attenuator) device made using silicon photonics, including passive and doped silicon waveguides and metalization.

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