The Role of Humidity in Tuning the Texture and Electrical Properties of Cu2O Thin Films Deposited via Aerosol‐Assisted CVD

2018 ◽  
pp. 1801364 ◽  
Author(s):  
Hongjun Liu ◽  
Viet Huong Nguyen ◽  
Hervé Roussel ◽  
Isabelle Gélard ◽  
Laetitia Rapenne ◽  
...  
Author(s):  
Daniel A. Fentahun ◽  
Alekha Tyagi ◽  
Sugandha Singh ◽  
Prerna Sinha ◽  
Amodini Mishra ◽  
...  

2020 ◽  
Vol 35 (7) ◽  
pp. 075016
Author(s):  
Miguel Tibério ◽  
Tomás Calmeiro ◽  
Suman Nandy ◽  
Daniela Nunes ◽  
Rodrigo Martins ◽  
...  

2019 ◽  
Vol 210 ◽  
pp. 27-34 ◽  
Author(s):  
C. Ravichandiran ◽  
A. Sakthivelu ◽  
R. Davidprabu ◽  
S. Valanarasu ◽  
A. Kathalingam ◽  
...  

2017 ◽  
Vol 49 ◽  
pp. 107-113 ◽  
Author(s):  
Leandro Merces ◽  
Rafael Furlan de Oliveira ◽  
Henrique Leonel Gomes ◽  
Carlos César Bof Bufon

2014 ◽  
Vol 289 ◽  
pp. 430-436 ◽  
Author(s):  
Anirban Chowdhury ◽  
Pavan Kumar Bijalwan ◽  
Ranjan Kumar Sahu
Keyword(s):  

2004 ◽  
Vol 808 ◽  
Author(s):  
Jianjun Zhang ◽  
Kousaku Shimizu ◽  
Jun-ichi Hanna

ABSTRACTWe have prepared poly-Si1-xGex thin films with different germanium contents (Ge=5%∼40%) by reactive thermal CVD. In this study, the Ge content was controlled by varying the source gases GeF4 flow rate at a fixed Si2H6 flow rate. The effects of GeF4 flow rate on growth rate, film crystallinity, and electrical properties were investigated. The films were always polycrystalline when GeF4 was introduced even in a small amount, while only amorphous film deposited without GeF4. With an increase in GeF4 flow rate, Ge content and conductivity of the films increased and its activation energy decreased. When GeF4 flow rate over a certain value, the growth rate decrease and finally no film could be deposited. These behaviors are discussed in relation with a role of GeF4 for the crystal growth at a low temperature.


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