Stretchable Electronics: Facile Preparation of High-Performance Elastically Stretchable Interconnects (Adv. Mater. 25/2015)

2015 ◽  
Vol 27 (25) ◽  
pp. 3709-3709 ◽  
Author(s):  
Andreas Polywka ◽  
Timo Jakob ◽  
Luca Stegers ◽  
Thomas Riedl ◽  
Patrick Görrn
2015 ◽  
Vol 27 (25) ◽  
pp. 3755-3759 ◽  
Author(s):  
Andreas Polywka ◽  
Timo Jakob ◽  
Luca Stegers ◽  
Thomas Riedl ◽  
Patrick Görrn

2021 ◽  
Vol 6 (28) ◽  
pp. 7130-7135
Author(s):  
Jing Ni ◽  
Yating Wang ◽  
Honghong Liang ◽  
Yuanhong Kang ◽  
Bichan Liu ◽  
...  

2021 ◽  
Vol 45 (7) ◽  
pp. 3581-3588
Author(s):  
Zhaokun Wang ◽  
Licong Jiang ◽  
Hongwei Pan ◽  
Yongyin Cui ◽  
Chengzhong Zong

A novel and environmentally-friendly resveratrol (RA) was used as an effective reagent for the preparation of reduced graphene oxide (rGO).


2016 ◽  
Vol 83 (4) ◽  
Author(s):  
Youlong Chen ◽  
Yong Zhu ◽  
Xi Chen ◽  
Yilun Liu

In this work, the compressive buckling of a nanowire partially bonded to an elastomeric substrate is studied via finite-element method (FEM) simulations and experiments. The buckling profile of the nanowire can be divided into three regimes, i.e., the in-plane buckling, the disordered buckling in the out-of-plane direction, and the helical buckling, depending on the constraint density between the nanowire and the substrate. The selection of the buckling mode depends on the ratio d/h, where d is the distance between adjacent constraint points and h is the helical buckling spacing of a perfectly bonded nanowire. For d/h > 0.5, buckling is in-plane with wavelength λ = 2d. For 0.27 < d/h < 0.5, buckling is disordered with irregular out-of-plane displacement. While, for d/h < 0.27, buckling is helical and the buckling spacing gradually approaches to the theoretical value of a perfectly bonded nanowire. Generally, the in-plane buckling induces smaller strain in the nanowire, but consumes the largest space. Whereas the helical mode induces moderate strain in the nanowire, but takes the smallest space. The study may shed useful insights on the design and optimization of high-performance stretchable electronics and three-dimensional complex nanostructures.


2021 ◽  
Author(s):  
Yogeenth Kumaresan ◽  
Nivasan Yogeswaran ◽  
Luigi G. Occhipinti ◽  
Ravinder Dahiya

Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.


2016 ◽  
Vol 364 ◽  
pp. 850-861 ◽  
Author(s):  
Kun Yan ◽  
Ling-Bin Kong ◽  
Kui-Wen Shen ◽  
Yan-Hua Dai ◽  
Ming Shi ◽  
...  

2019 ◽  
Vol 30 (4) ◽  
pp. 4336-4337
Author(s):  
Zengcai Guo ◽  
Jingbo Mu ◽  
Hongwei Che ◽  
Guangshuo Wang ◽  
Aifeng Liu ◽  
...  

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