Inkjet Printing Short-Channel Polymer Transistors with High-Performance and Ultrahigh Photoresponsivity

2014 ◽  
Vol 26 (27) ◽  
pp. 4683-4689 ◽  
Author(s):  
Hanlin Wang ◽  
Cheng Cheng ◽  
Lei Zhang ◽  
Hongtao Liu ◽  
Yan Zhao ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
High Performance ◽  
Short Channel

scholarly journals Transistors: Inkjet Printing Short-Channel Polymer Transistors with High-Performance and Ultrahigh Photoresponsivity (Adv. Mater. 27/2014)

2014 ◽  
Vol 26 (27) ◽  
pp. 4752-4752
Author(s):  
Hanlin Wang ◽  
Cheng Cheng ◽  
Lei Zhang ◽  
Hongtao Liu ◽  
Yan Zhao ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
High Performance ◽  
Short Channel

Co-planar two-dimensional Metal-Insulator-Semiconductor Capacitor: Numerical study of the device electrostatics.

2017 ◽  
Author(s):  
Varun Bheemireddy
Keyword(s):  
Space Charge ◽  
High Performance ◽  
Numerical Study ◽  
2D Materials ◽  
Space Charge Density ◽  
Two Dimensional ◽  
Short Channel ◽  
Metal Insulator ◽  
Metal Insulator Semiconductor ◽  
New Family

The two-dimensional(2D) materials are highly promising candidates to realise elegant and e cient transistor. In the present letter, we conjecture a novel co-planar metal-insulator-semiconductor(MIS) device(capacitor) completely based on lateral 2D materials architecture and perform numerical study of the capacitor with a particular emphasis on its di erences with the conventional 3D MIS electrostatics. The space-charge density features a long charge-tail extending into the bulk of the semiconductor as opposed to the rapid decay in 3D capacitor. Equivalently, total space-charge and semiconductor capacitance densities are atleast an order of magnitude more in 2D semiconductor. In contrast to the bulk capacitor, expansion of maximum depletion width in 2D semiconductor is observed with increasing doping concentration due to lower electrostatic screening. The heuristic approach of performance analysis(2D vs 3D) for digital-logic transistor suggest higher ON-OFF current ratio in the long-channel limit even without third dimension and considerable room to maximise the performance of short-channel transistor. The present results could potentially trigger the exploration of new family of co-planar at transistors that could play a signi significant role in the future low-power and/or high performance electronics.<br>

48.1: Invited Paper: Inkjet printing of homogeneous and green cellulose nanofibrils dielectric for high performance IGZO TFTs

2021 ◽  
Vol 52 (S2) ◽  
pp. 580-581
Author(s):  
Honglong Ning ◽  
Shangxiong Zhou ◽  
Zhuohui Xu ◽  
Zhiqiang Fang ◽  
Jinyao Zhong ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
High Performance ◽  
Cellulose Nanofibrils

scholarly journals Performance Measures of Different Gate Oxide Materials in Gate All Around Fet

2020 ◽  
Vol 9 (2) ◽  
pp. 23-25
Keyword(s):  
High Performance ◽  
Field Effect Transistors ◽  
Gate Oxide ◽  
Oxide Semiconductor ◽  
Oxide Materials ◽  
Performance Limits ◽  
Short Channel ◽  
Advanced Technique ◽  
And Performance

The classical planar Metal Oxide Semiconductor Field Effect Transistors (MOSFET) is fabricated by oxidation of a semiconductor namely Silicon. In this generation, an advanced technique called 3D system architecture FETs, are introduced for high performance and low power quality of devices. Based on the limitations of Short Channel Effect (SCE), Silicon (Si) FET cannot be scaled under 10nm. Hence various performing measures like methods, principles, and geometrics are done to upscale the semiconductor. CMOS using alternate channel materials like GE and III-Vs on substrates is a highly anticipated technique for developing nanowire structures. By considering these issues, in this paper, we developed a simulation model that provides accurate results basing on Gate layout and multi-gate NW FET's so that the scaling can be increased few nanometers long and performance limits gradually increases. The model developed is SILVACO that tests the action of FET with different gate oxide materials.

scholarly journals Low Power based Dynamic TSPC D flip flop for High Performance Applications

2020 ◽  
Vol 9 (8) ◽  
pp. 758-762
Keyword(s):  
Low Power ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistor ◽  
Memory Cell ◽  
Research Center ◽  
Short Channel ◽  
Flip Flop ◽  
Force Application ◽  
Effect Transistor

D flip-flop is viewed as the most basic memory cell in by far most of computerized circuits, which brings it broad usage, particularly under current conditions where high-thickness pipeline innovation is as often as possible utilized in advanced coordinated circuits and flip-flop modules are key segments. As a constant research center, various sorts of zero flip-flops have been concocted and explored, and the ongoing exploration pattern has gone to rapid low-control execution, which can be come down to low power-defer item. To actualize superior VLSI, picking the most proper D flip-flop has clearly become an incredibly huge part in the structure stream. The quick headway in semiconductor innovation made it practicable to coordinate entire electronic framework on a solitary chip. CMOS innovation is the most doable semiconductor innovation yet it neglects to proceed according to desires past and at 32nm innovation hub because of the short channel impacts. GNRFET is Graphene Nano Ribbon Field Effect Transistor, it is seen that GNRFET is a promising substitute for low force application for its better grasp over the channel. In this paper, an audit on Dynamic Flip Flop and GNRFET is introduced. The power is improved in the proposed circuit for the D flip flop TSPC.

High-resolution electrohydrodynamic inkjet printing of stretchable metal oxide semiconductor transistors with high performance

Nanoscale ◽  
2016 ◽  
Vol 8 (39) ◽  
pp. 17113-17121 ◽  
Author(s):  
S.-Y. Kim ◽  
K. Kim ◽  
Y. H. Hwang ◽  
J. Park ◽  
J. Jang ◽  
...  
Keyword(s):  
High Resolution ◽  
Metal Oxide ◽  
Inkjet Printing ◽  
High Performance ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor

Analysis and Simulation of a Low-Leakage Analog Single Gate and FinFET Circuits

2014 ◽  
Vol 13 (02) ◽  
pp. 1450012 ◽  
Author(s):  
Manorama Chauhan ◽  
Ravindra Singh Kushwah ◽  
Pavan Shrivastava ◽  
Shyam Akashe
Keyword(s):  
Integrated Circuits ◽  
Metal Oxide ◽  
Low Power ◽  
High Performance ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Short Channel ◽  
State Dependency ◽  
Low Leakage

In the world of Integrated Circuits, complementary metal–oxide–semiconductor (CMOS) has lost its ability during scaling beyond 50 nm. Scaling causes severe short channel effects (SCEs) which are difficult to suppress. FinFET devices undertake to replace usual Metal Oxide Semiconductor Field Effect Transistor (MOSFETs) because of their better ability in controlling leakage and diminishing SCEs while delivering a strong drive current. In this paper, we present a relative examination of FinFET with the double gate MOSFET (DGMOSFET) and conventional bulk Si single gate MOSFET (SGMOSFET) by using Cadence Virtuoso simulation tool. Physics-based numerical two-dimensional simulation results for FinFET device, circuit power is presented, and classifying that FinFET technology is an ideal applicant for low power applications. Exclusive FinFET device features resulting from gate–gate coupling are conversed and efficiently exploited for optimal low leakage device design. Design trade-off for FinFET power and performance are suggested for low power and high performance applications. Whole power consumptions of static and dynamic circuits and latches for FinFET device, believing state dependency, show that leakage currents for FinFET circuits are reduced by a factor of over ~ 10X, compared to DGMOSFET and ~ 20X compared with SGMOSFET.

Flexible, high mobility short-channel organic thin film transistors and logic circuits based on 4H-21DNTT

2021 ◽  
Author(s):  
Anubha Bilgaiyan ◽  
Seung-Il Cho ◽  
Miho Abiko ◽  
Kaori Watanabe ◽  
Makoto Mizukami
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
High Performance ◽  
Channel Length ◽  
Logic Circuits ◽  
Organic Thin Film Transistors ◽  
Limiting Factors ◽  
Organic Thin Film ◽  
Short Channel ◽  
Inverter Circuit

Abstract The low mobility and large contact resistance in organic thin-film transistors (OTFTs) are the two major limiting factors in the development of high-performance organic logic circuits. Here, solution-processed high-performance OTFTs and circuits are reported with a polymeric gate dielectric and 6,6 bis (trans-4-butylcyclohexyl)-dinaphtho[2,1-b:2,1-f ]thieno[3,2-b]thiophene (4H-21DNTT) for the organic semiconducting layer. By optimizing and controlling the fabrication conditions, a record high saturation mobility of 8.8 cm2V− 1s− 1 was demonstrated as well as large on/off ratios (> 106) for relatively short channel lengths of 15 µm and an average carrier mobility of 10.5 cm2V-1s-1 for long channel length OTFTs (> 50 µm). The pseudo-CMOS inverter circuit with a channel length of 15 µm exhibited sharp switching characteristics with a high signal gain of 31.5 at a supply voltage of 20 V. In addition to the inverter circuit, NAND logic circuits were further investigated, which also exhibited remarkable logic characteristics, with a high gain, an operating frequency of 5 kHz, and a short propagation delay of 22.1 µs. The uniform and reproducible performance of 4H-21DNTT OTFTs show potential for large-area, low-cost real-world applications on industry-compatible bottom-contact substrates.

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