Minkowski Tensor Shape Analysis of Cellular, Granular and Porous Structures

2011 ◽  
Vol 23 (22-23) ◽  
pp. 2535-2553 ◽  
Author(s):  
G. E. Schröder-Turk ◽  
W. Mickel ◽  
S. C. Kapfer ◽  
M. A. Klatt ◽  
F. M. Schaller ◽  
...  
Keyword(s):  
Shape Analysis ◽  
Porous Structures ◽  
Minkowski Tensor

3D CT Cephalometry of Plagiocephaly: Asymmetry and Shape Analysis

2005 ◽  
Author(s):  
David Netherway ◽  
Amanda Abbott ◽  
Nadim Gulamhuseinwala ◽  
Karen McGlaughlin ◽  
Peter Anderson ◽  
...  
Keyword(s):  
Shape Analysis ◽  
3D Ct

MICROSCALE TWO PHASE HEAT TRANSFER ENHANCEMENT IN POROUS STRUCTURES

Equipment ◽  
2006 ◽  
Author(s):  
Leonid L. Vasiliev ◽  
A. Zhuravlyov ◽  
A. Shapovalov ◽  
L. L. Vasiliev, Jr
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Porous Structures ◽  
Transfer Enhancement ◽  
Two Phase ◽  
Two Phase Heat Transfer

Experimental Investigation of the Hydrocarbons Pool Boiling on Porous Structures

2002 ◽  
Author(s):  
Leonard L. Vasiliev ◽  
Alexander S. Zhuravlyov ◽  
Mikhail N. Novikov ◽  
A.V. Ovsianik ◽  
Leonid L. Vasiliev, Jr.
Keyword(s):  
Experimental Investigation ◽  
Pool Boiling ◽  
Porous Structures

Soot Particle Deposition within Porous Structures using a Method-of-Moments-Lattice-Boltzmann Approach

2006 ◽  
Vol v4 (i2) ◽  
pp. 221-232
Author(s):  
Bernhard F.W. Gschaider ◽  
Claudia C. Honeger ◽  
Christian E. P. Redl ◽  
Johannes Leixnering
Keyword(s):  
Method Of Moments ◽  
Lattice Boltzmann ◽  
Particle Deposition ◽  
Soot Particle ◽  
Porous Structures

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

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