Study of the Hole Transport Processes in Solution-Processed Layers of the Wide Bandgap Semiconductor Copper(I) Thiocyanate (CuSCN)

2015 ◽  
Vol 25 (43) ◽  
pp. 6802-6813 ◽  
Author(s):  
Pichaya Pattanasattayavong ◽  
Alexander D. Mottram ◽  
Feng Yan ◽  
Thomas D. Anthopoulos
2021 ◽  
Vol 119 (5) ◽  
pp. 051906
Author(s):  
C. Yu ◽  
P. Andalib ◽  
A. Sokolov ◽  
O. Fitchorova ◽  
W. Liang ◽  
...  

2021 ◽  
Vol 12 (11) ◽  
pp. 1692-1699
Author(s):  
Ji Hye Lee ◽  
Jinhyo Hwang ◽  
Chai Won Kim ◽  
Amit Kumar Harit ◽  
Han Young Woo ◽  
...  

New polystyrene-based polymers with high π-extended hole transport pendants were synthesized to obtain a low turn-on voltage and high efficiency in solution-processed green TADF-OLEDs.


Materials ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 554
Author(s):  
Taeshik Earmme

Solution-processed blue phosphorescent organic light-emitting diodes (PHOLEDs) based on a single emission layer with small-molecule hole-transport materials (HTMs) are demonstrated. Various HTMs have been readily incorporated by solution-processing to enhance hole-transport properties of the polymer-based emission layer. Poly(N-vinylcarbazole) (PVK)-based blue emission layer with iridium(III) bis(4,6-(di-fluorophenyl)pyridinato-N,C2′)picolinate (FIrpic) triplet emitter blended with solution-processed 1,1-bis[(di-4-tolylamino)phenyl]cyclohexane (TAPC) gave luminous efficiency of 21.1 cd/A at a brightness of 6220 cd/m2 with an external quantum efficiency (EQE) of 10.6%. Blue PHOLEDs with solution-incorporated HTMs turned out to be 50% more efficient compared to the reference device without HTMs. The high hole mobility, high triplet energy of HTM, and favorable energy transfer between HTM blended PVK host and FIrpic blue dopant were found to be important factors for achieving high device performance. The results are instructive to design and/or select proper hole-transport materials in solution-processed single emission layer.


2019 ◽  
Vol 31 (36) ◽  
pp. 1903580 ◽  
Author(s):  
Chuanhui Gong ◽  
Junwei Chu ◽  
Chujun Yin ◽  
Chaoyi Yan ◽  
Xiaozong Hu ◽  
...  

2015 ◽  
Vol 54 (11) ◽  
pp. 110302 ◽  
Author(s):  
Sandhya Chintalapati ◽  
Yongqing Cai ◽  
Ming Yang ◽  
Lei Shen ◽  
Yuan Ping Feng

2005 ◽  
Vol 900 ◽  
Author(s):  
Claudiu I. Muntele ◽  
Sergey Sarkisov ◽  
Iulia Muntele ◽  
Daryush Ila

ABSTRACTSilicon carbide is a promising wide-bandgap semiconductor intended for use in fabrication of high temperature, high power, and fast switching microelectronics components running without cooling. For hydrogen sensing applications, silicon carbide is generally used in conjunction with either palladium or platinum, both of them being good catalysts for hydrogen. Here we are reporting on the temperature-dependent surface morphology and depth profile modifications of Au, Ti, and W electrical contacts deposited on silicon carbide substrates implanted with 20 keV Pd ions.


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