Direct Low-Temperature Integration of Nanocrystalline Diamond with GaN Substrates for Improved Thermal Management of High-Power Electronics

2012 ◽  
Vol 22 (7) ◽  
pp. 1525-1530 ◽  
Author(s):  
Vivek Goyal ◽  
Anirudha V. Sumant ◽  
Desalegne Teweldebrhan ◽  
Alexander A. Balandin
Keyword(s):  
Low Temperature ◽  
Power Electronics ◽  
Thermal Management ◽  
High Power ◽  
Nanocrystalline Diamond

scholarly journals Low temperature Cu joining by in situ reduction-sintering of CuO nanoparticle for high power electronics

2020 ◽  
Vol 31 (10) ◽  
pp. 4135-4144
Author(s):  
Yang Zuo ◽  
Sadie Carter-Searjeant ◽  
Mark Green ◽  
Liam Mills ◽  
Samjid H. Mannan
Keyword(s):  
Low Temperature ◽  
Power Electronics ◽  
High Power ◽  
In Situ Reduction ◽  
Cuo Nanoparticle

Thermal management in high-power electronics cooled down using capillary pump

2003 ◽  
Author(s):  
Boguslaw Wiecek ◽  
Tomasz Wajman ◽  
Mariola Felczak ◽  
Marek Berlinski
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
High Power

Simulations of Metal Foam Cooling of High-Power Electronics Using the Equivalent Thermal Conductivity

2003 ◽  
Author(s):  
Nihad Dukhan ◽  
Pable D. Quinones
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Power Electronics ◽  
Thermal Management ◽  
High Power ◽  
Metal Foam ◽  
Maximum Temperature ◽  
Transfer Model ◽  
Aluminum Foams ◽  
Equivalent Thermal Conductivity

A one-dimensional heat transfer model for open-cell metal foam is presented. The model includes both the conduction and the convection in the ligaments and in the pores of the foam. It uses the typical foam parameters provided by the manufacturers. Three aluminum foams having different relative surface areas, relative densities, ligament diameters, and number of pores per inch are analyzed and an effective thermal conductivity is determined. The heat transfer increases with the number of pores per inch. The resulting improvement in heat transfer can be as high as 57 percent over solid aluminum. The model is general enough such that it can handle other types of foam and geometries. For simulations using packages for thermal management, the foam can be modeled as a solid having an equivalent conductivity with an effective convection heat transfer on its outer surfaces. This eliminates the need to model the microscopic flow and heat transfer in and around the pores. It also allows quick feasibility studies and comparisons of different arrangements using aluminum foams for thermal management systems of high-power electronics. A few such simulations are presented in this work. The simulations show a big promise for using the foam in place of the traditional heat sinks for cooling high-power electronics: they reduce the cooling system’s weight substantially and reduce the maximum temperature significantly.

scholarly journals Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2689
Author(s):  
Liang Chen ◽  
Xingchen Li ◽  
Runfeng Xiao ◽  
Kunpeng Lv ◽  
Xue Yang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Power Electronics ◽  
Thermal Management ◽  
High Power ◽  
Flow Boiling ◽  
Width Ratio ◽  
Bubble Behavior ◽  
Uniform Wall Temperature ◽  
Pressure Water ◽  
Uniform Wall

Flow boiling heat transfer in microchannels can provide a high cooling rate, while maintaining a uniform wall temperature, which has been extensively studied as an attractive solution for the thermal management of high-power electronics. The depth-to-width ratio of the microchannel is an important parameter, which not only determines the heat transfer area but also has dominant effect on the heat transfer mechanisms. In the present study, numerical simulations based on the volume of fraction models are performed on the flow boiling in very deep microchannels. The effects of the depth-to-width ratio on the heat transfer coefficient and pressure drop are discussed. The bubble behavior and heat transfer characteristics are analyzed to explain the mechanism of heat transfer enhancement. The results show the very deep microchannels can effectively enhance the heat transfer, lower the temperature rise and show promising applications in the thermal management of high-power electronics.

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