scholarly journals Nanofabrication on 2D and 3D Topography via Positive‐Tone Direct‐Write Laser Lithography

2019 ◽  
Vol 22 (2) ◽  
pp. 1901290
Author(s):  
Samuli Heiskanen ◽  
Zhuoran Geng ◽  
Jaakko Mastomäki ◽  
Ilari J. Maasilta
2004 ◽  
Vol 15 (10) ◽  
pp. S628-S633 ◽  
Author(s):  
E Forsén ◽  
S G Nilsson ◽  
P Carlberg ◽  
G Abadal ◽  
F Pérez-Murano ◽  
...  

2001 ◽  
Vol 698 ◽  
Author(s):  
Bradley R. Ringeisen ◽  
Heungsoo Kim ◽  
H. Daniel Young ◽  
Barry J. Spargo ◽  
R.C.Y. Auyeung ◽  
...  

ABSTRACTThis paper outlines investigations into a potentially revolutionary approach to tissue engineering. Tissue is a complex three-dimensional structure that contains many different biomaterials such as cells, proteins, and extracellular matrix molecules that are ordered in a very precise way to serve specific functions. In order to replicate such complex structure, it is necessary to have a tool that could deposit all these materials in an accurate and controlled fashion. Most methods to fabricate living three-dimensional structures involve techniques to engineer biocompatible and biodegradable scaffolding, which is then seeded with living cells to form tissue. This scaffolding gives the tissue needed support, but the resulting tissue inherently has no microscopic cellular structure because cells are injected into the scaffolding where they adhere at random. We have developed a novel technique that actually engineers tissue, not scaffolding, that includes the mesoscopic cellular structure inherent in natural tissues. This approach uses a laser-based rapid prototyping system known as matrix assisted pulsed laser evaporation direct write (MAPLE DW) to construct living tissue cell-by-cell. This manuscript details our efforts to rapidly and reproducibly fabricate complex 2D and 3D tissue structures with MAPLE-DW by placing different cells and biomaterials accurately and adherently on the mesoscopic scale


1997 ◽  
Vol 490 ◽  
Author(s):  
T. S. Cale ◽  
T. P. Merchant ◽  
L. J. Borucki

ABSTRACTAfter discussing topography simulation, we summarize two approaches used to move surfaces in topography simulators used in virtual semiconductor wafer fabs; “front tracking” and “level set”. Front tracking is presented for two dimensional (2d) surfaces, and a number of examples are shown to demonstrate the approach. The level set approach is presented for three dimensional (3d) surfaces, and examples are shown. Though either approach could be used in both 2d and 3d topography simulators, this is by and large the current usage. Transport and reaction submodels needed for physically based process simulations will continue to be developed using experiments performed on structures that are inherently 2d, combined with three dimensional 3d transport simulations; i.e., “3d/2d” simulations. Three dimensional device structures will be generated using “3d/3d” topography simulations, using robust codes. Plasma enhanced deposition of silicon dioxide from TEOS is used as an example of how 3d/2d and 3d/3d simulations are used.


2015 ◽  
Vol 48 (17) ◽  
pp. 175301 ◽  
Author(s):  
Madhushree G Bute ◽  
Shashikant D Shinde ◽  
Dhananjay Bodas ◽  
H Fouad ◽  
K P Adhi ◽  
...  

1998 ◽  
Vol 55 (1-2) ◽  
pp. 71-78 ◽  
Author(s):  
T.K.S. Wong ◽  
S. Gao ◽  
X. Hu ◽  
H. Liu ◽  
Y.C. Chan ◽  
...  

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