Intermetallic Phase Formation in Bulk Multilayered Structures

2006 ◽  
pp. 324-329
Author(s):  
H. Sieber ◽  
J. H. Perepezko
Keyword(s):  
Phase Formation ◽  
Intermetallic Phase ◽  
Multilayered Structures

Peculiarities of Intermetallic Phase Formation in the Process of a Solid State Reaction in (Al/Cu)n Multilayer Thin Films

JOM ◽  
2021 ◽  
Author(s):  
Evgeny T. Moiseenko ◽  
Sergey M. Zharkov ◽  
Roman R. Altunin ◽  
Oleg V. Belousov ◽  
Leonid A. Solovyov ◽  
...  
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Phase Formation ◽  
Solid State Reaction ◽  
Intermetallic Phase ◽  
Multilayer Thin Films

Intermetallic phase formation and evolution during homogenization and solution in Al-Zn-Mg-Cu alloys

2013 ◽  
Vol 56 (11) ◽  
pp. 2827-2838 ◽  
Author(s):  
ChunMei Li ◽  
ZhiQian Chen ◽  
SuMin Zeng ◽  
NanPu Cheng ◽  
TianXiao Chen
Keyword(s):  
Phase Formation ◽  
Intermetallic Phase ◽  
Cu Alloys ◽  
Formation And Evolution

Intermetallic phase formation in diffusion-bonded Cu/Al laminates

2010 ◽  
Vol 46 (8) ◽  
pp. 2467-2473 ◽  
Author(s):  
Yajie Guo ◽  
Guiwu Liu ◽  
Haiyun Jin ◽  
Zhongqi Shi ◽  
Guanjun Qiao
Keyword(s):  
Phase Formation ◽  
Intermetallic Phase

Comparison of Electroplated Ni and PVD Ni Coating Layers after Soft Soldering Process

2019 ◽  
Vol 809 ◽  
pp. 367-371
Author(s):  
Jessica Richter ◽  
Benjamin Schellscheidt ◽  
Anna Steenmann ◽  
Thomas Licht
Keyword(s):  
Composite Material ◽  
Phase Formation ◽  
Intermetallic Phase ◽  
Adhesive Layer ◽  
Performance Comparison ◽  
Growth Patterns ◽  
Process Time ◽  
Power Electronic ◽  
Columnar Growth ◽  
Soldering Process

This work is part of a publicly funded project called ReffiMaL (resource efficient material solutions for power electronics), which aims to substitute electroplated Nickel (Ni) as contact material in power electronic modules. The baseplates of these power electronic modules are based on the metal matrix composite material AlSiC, which needs to be coated to become solderable. Today, it is state-of-the-art technology to coat the baseplate with electroplated Ni to form an adhesive layer to the system solder. In this paper we present a performance comparison of physical vapor deposited (PVD) Ni and electroplated Ni. The main advantage of PVD Ni is a significant reduction of layer thickness compared to the electroplating process. Second advantage of PVD Ni is the limitation of the deposition to areas that get soldered, in contrast to a non-selective electroplated coating. When deposited by PVD at room temperature, Ni exhibits columnar growth patterns, whereas electroplated Ni tends to form a laminar layer. The columnar growth leads to an increase in interface area affecting phase formation behavior. To compare both adhesion layers, we investigate the phase formation after soldering with a Sn based soft solder-copper composite material. The baseplates are reflow-soldered at different temperatures and process times. Temperature varied between 270°C and 400°C. The corresponding process time ranged from 10 to 40 minutes. We inspect the samples optically to determine the phase formation. Intermetallic phase (IMP) composition is evaluated using energy dispersive X-ray analysis (EDX). ReffiMaL is funded by the German Federal Ministry of Education and Research (BMBF).

scholarly journals Intermetallic phase formation during annealing of Al/Ni multilayers

1994 ◽  
Vol 76 (12) ◽  
pp. 7850-7859 ◽  
Author(s):  
A. S. Edelstein ◽  
R. K. Everett ◽  
G. Y. Richardson ◽  
S. B. Qadri ◽  
E. I. Altman ◽  
...  
Keyword(s):  
Phase Formation ◽  
Intermetallic Phase

Intermetallic phase formation in aluminium and iron thin film systems

1988 ◽  
Vol 167 (1-2) ◽  
pp. 203-216 ◽  
Author(s):  
A. Csanády ◽  
J.R. Günter ◽  
P.B. Barna ◽  
J. Mayer
Keyword(s):  
Thin Film ◽  
Phase Formation ◽  
Intermetallic Phase
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