Virtual Qualification of Electronic Hardware

Electronic hardware for high resolution time-of-flight measurements

International Journal of Mass Spectrometry and Ion Physics ◽

10.1016/0020-7381(79)80042-x ◽

1979 ◽

Vol 30 (1) ◽

pp. 57-62 ◽

Cited By ~ 8

Author(s):

M. Armenante ◽

V. Santoro ◽

N. Spinelli ◽

F. Vanoli

Keyword(s):

High Resolution ◽

Time Of Flight ◽

Resolution Time ◽

Electronic Hardware ◽

Flight Measurements

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Novel electronic hardware for pulse-mode neural circuits

Proceedings of the 39th Midwest Symposium on Circuits and Systems ◽

10.1109/mwscas.1996.594213 ◽

2002 ◽

Author(s):

K.P. Roenker ◽

Chungkun Song

Keyword(s):

Neural Circuits ◽

Pulse Mode ◽

Electronic Hardware

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Control Electronics and Hybrid Dynamic System-Based API for a 6-DOF Desktop Haptic Interface

10.1115/imece1999-0056 ◽

1999 ◽

Author(s):

S. E. Salcudean ◽

R. Six ◽

R. Barman ◽

S. Kingdon ◽

I. Chau ◽

...

Keyword(s):

Dynamic System ◽

Haptic Interface ◽

State Transitions ◽

Hybrid Dynamic System ◽

Finite State ◽

Control Electronics ◽

Six Degree Of Freedom ◽

Electronic Hardware ◽

Device Location ◽

Programming Interface

Abstract A six-degree-of-freedom desktop magnetically levitated haptic interface has been developed by the authors. Its electromechanical design is described in (Salcudean and Parker, 1997). In this paper, aspects of electronic hardware architecture and the control of actuator currents are discussed. To program this device, a new low level applications programming interface (API) that models the haptic interface as a hybrid dynamic system is proposed. The user can define a finite state machine in which every state is a device impedance. State transitions occur upon the satisfaction of linear inequalities in terms of the device location, velocity and force. Examples of the use of such hybrid dynamic systems to produce haptic effects are given.

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First-Level Packaging Considerations for the use of Electronic Hardware at High Temperatures

High Temperature Electronics ◽

10.1201/9780203751978-5 ◽

2018 ◽

pp. 129-162

Keyword(s):

High Temperatures ◽

Electronic Hardware

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Electronic Hardware Reliability

Electronic Systems Maintenance Handbook, Second Edition - Electronics Handbook Series ◽

10.1201/9781420036855.ch2 ◽

2001 ◽

Author(s):

Michael Pecht ◽

Iuliana Bordelon

Keyword(s):

Hardware Reliability ◽

Electronic Hardware

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The “modeling clay” approach to bio-inspired electronic hardware

Evolvable Systems: From Biology to Hardware - Lecture Notes in Computer Science ◽

10.1007/bfb0057626 ◽

1998 ◽

pp. 248-255 ◽

Cited By ~ 3

Author(s):

Ken Hayworth

Keyword(s):

Electronic Hardware ◽

Modeling Clay

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Design and characterization of a copper microchannel heat sink for SiP cooling

Modern Physics Letters B ◽

10.1142/s0217984921400157 ◽

2021 ◽

pp. 2140015

Author(s):

Min Miao ◽

Hao Zhang ◽

Hejie Yu ◽

Lili Cao

Keyword(s):

Heat Flux ◽

Heat Sink ◽

Heat Dissipation ◽

Electrical Discharge Machining ◽

Copper Substrate ◽

Integrated System ◽

Peak Temperature ◽

Microchannel Heat Sink ◽

Set Up ◽

Electronic Hardware

With the increasing flourishing of miniaturized, multifunctional, and heterogeneously integrated system in package (SiP), heating problem is becoming more and more serious. In this paper, to meet the heat dissipation needs of the chips thus assembled and to achieve effective thermal management, linear, serpent and spiral shaped microchannel heat sinks were designed and fabricated into copper substrate by electrical discharge machining (EDM) and precision machining technology, acting both as the cooler and mounting base for passive and active SiP interposers. A test platform was set up to characterize the heat dissipation performance of the copper-based microchannel heat sink. The experimental and simulation results show that heat dissipation rate increases with the increasing heat flux density in the range 5–30 W/cm2 for the three microchannel designs, and the peak temperature can all be kept below 340 K (67[Formula: see text]C) even for the highest heat flux. The three designs are compared from the perspective of peak temperature, temperature distribution uniformity and pressure drop. In all, the solution proposed hereby provides a new and optimal option for in-situ cooling for densely integrated electronic hardware.

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Fifty years of Electronic Hardware Implementations of First and Higher Order Neural Networks

Artificial Higher Order Neural Networks for Computer Science and Engineering ◽

10.4018/978-1-61520-711-4.ch012 ◽

2010 ◽

pp. 269-285 ◽

Cited By ~ 3

Author(s):

David R. Selviah ◽

Janti Shawash

Keyword(s):

Neural Networks ◽

Real Time ◽

High Speed ◽

Higher Order ◽

Low Latency ◽

Real Time Control ◽

Practical Applications ◽

Field Programmable ◽

On Chip ◽

Electronic Hardware

This chapter celebrates 50 years of first and higher order neural network (HONN) implementations in terms of the physical layout and structure of electronic hardware, which offers high speed, low latency, compact, low cost, low power, mass produced systems. Low latency is essential for practical applications in real time control for which software implementations running on CPUs are too slow. The literature review chapter traces the chronological development of electronic neural networks (ENN) discussing selected papers in detail from analog electronic hardware, through probabilistic RAM, generalizing RAM, custom silicon Very Large Scale Integrated (VLSI) circuit, Neuromorphic chips, pulse stream interconnected neurons to Application Specific Integrated circuits (ASICs) and Zero Instruction Set Chips (ZISCs). Reconfigurable Field Programmable Gate Arrays (FPGAs) are given particular attention as the most recent generation incorporate Digital Signal Processing (DSP) units to provide full System on Chip (SoC) capability offering the possibility of real-time, on-line and on-chip learning.

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